This walkthrough goes through the process of creating a PSoC® 4100S Plus prototyping board PCB footprint.
Lead pitch (row-to-row spacing) = 100 mils (2.54 mm OR 0.1 in)
Terminal row spacing (pin-to-pin spacing) = 800 mils (20.32 mm OR 0.8 in)
Package (Board) width = 960 mils (24.384 mm OR 0.96 in)
Package (Board) length = 5000 mils (127 mm OR 5 in)
It is optional and recommended to reference its mechanical design dimensions from the ZIP file (i.e., CY8CKIT-149 Design Files.zip) which is located on the CY8CKIT-149 website.
Figure 1: “New Drawing” window |
In the "New Drawing" window (see Figure 1), click "Browse..." and select the location of your cadence PCB project folder. Then, enter a drawing name of your choice. Do not use spaces in the drawing name. Choose a "Drawing Type" of "Package symbol(wizard)" and click OK to return to the empty drawing window.
After clicking OK the window will open. Choose DIP as shown below in Figure 2, then click Next.
Figure 2: Package Type |
Figure 3: Template Page |
Figure 4: General Parameters |
Figure 5: DIP parameters |
Figure 6: Padstack selection |
Leave the default Symbol compilation settings as they are and push next.
Push finish on the next page to finish the package.
Once you have finished using the package wizard, you should have a package that looks like Figure 8. You will need to move the geometry down until you get a package that fits the package geometry of the actual PSoC4100S (see Figure 9). To move the box, click on the box and click the “Move” tool (see Figure 7) then grab the rectangular boxes then drag each one down. There should be 3 boxes to move the one behind the other two boxes down, move the top two boxes to the side.
Figure 7: Move tool highlighted in yellow |
Figure 8: Package after finishing package wizard |
Figure 9: Finished package after moving down geometry |