A ground plane is a large area of copper in a printed circuit board design that is connected to ground on the power supply.
Figure 1: Example PCB layout with un-routed ground traces in blue |
In the toolbar, click on the Add Rectangle tool (see Figure 2) and select the “Options” tab on the right side of the screen (see Figure 3). Do not draw a rectangle yet.
Figure 2: Add rectangle tool |
Figure 3: Options tab for the Add Rectangle tool |
In the Options tab, click on the “…” button (see Figure 4) near “Assign net name” and choose your ground net (see Figure 5). Click OK to close the “Select a net” dialog box.
Figure 4: ... button to assign ground net name |
Figure 5: “Select a net” dialog box |
Draw a rectangle around all of the placed components. If the above steps were completed correctly, the blue rats nest connections should disappear and ground pins electrically connected to the ground plane (see example, Figure 6).
Figure 6: Ground rectangle placed |
Figures 7 and 8 below show closeups “before ground plane” and “after ground plane” connections.
Figure 7: Closeup of board design before ground plane |
Figure 8: Closeup of board design after ground plane |
As you can see in Figure 8 above, the connections between the ground pins and the ground plane are very small (5 mils), making them a potential point of unreliability or failure in the design. Connections to power and ground should be a minimum of 20 mils, or larger if using higher currents (use a trace width calculator to determine the minimum size).
To increase the size of the connections between pins and the ground plane, choose Shape > Global Dynamic Params… (see Figure 9).
Figure 9: Global Dynamic Parameters menu option |
Select the “Clearances” tab (see Figure 10) and update the oversize values to a larger number (20 mils or greater) to make the design easier to manufacture and test.
Figure 10: Clearances tab with updated oversize clearance values |
Select the “Thermal relief connects” tab (see Figure 11) and update the thermal width to a larger number (20 mils, or greater for higher currents). Click “OK” to apply the changes.
Figure 11: Thermal relief connects tab with updated thermal width |
Figures 12 and 13 below show closeups before and after the changes to the global dynamic parameters. Note that changes are applied to the entire design, not just a single pad.
Figure 12: Example pad before global dynamic parameters adjustments |
Figure 13: Example pad after global dynamic parameters adjustments |
A “ground island” is a section of a ground plane that is isolated from the rest of the circuit. Ground islands can often be discovered through careful examination of a design with a ground plane, noticing where a rats nest wire still exists (see example, Figure 14).
Figure 14: Example “ground island” |
A ground island can be fixed by adding a via between the ground island and the remainder of the ground plane (see example, Figure 15).
Figure 15: Repaired ground island |
Figure 16: Completed PCB design with ground plane |
A void, rubout, or anti-etch is a place where the copper is fully removed from the PCB. A common use of rubouts is underneath Bluetooth or Wifi antennas (e.g., from a ESP32, Photon, or Argon) as having a ground plane underneath an antenna will effectively shield RF waves from reaching the antenna. At best this will mean reduced range for a wireless device, and at worst it will mean that the device will not connect wirelessly.
First, make sure you have placed all of the components on your PCB (and ideally have not started routing traces yet, though this can still be done even if you have routed traces).
Choose Shape > Manual Void/Cavity and choose a shape of your liking (see Figure 17).
Figure 17: Anti-etch selection |
Figure 18: Anti-etch example under a PSoC® 5 footprint |
Figure 19: Delete tool for manual void/cavity |